This will help in quick turn around by avoiding faults at DFM level. Solder pad and via hole must not overlap.ģ- Copper pads, Thickness, Trace width should be considered.Īfter performing the DFM check, the manufacturer can easily reduce the cost of manufacturing by cutting down the number of scrapped boards. Spacing between holes and spacing between hole and trace should be checked. The components requiring heat sinks should have enough space for other components so that heat sink do not get touch. ICs notch/head direction must be checked. Like Electrolytic capacitor polarity must be checked, diode anode and cathode polarity check, SMT tantalum capacitors polarity check. The Manufacturer must carry out these basic DFM steps to ensure flawless PCB.ġ- Component Layout Consideration: Through hole components with polarity must be checked. This process is called Design for Manufacturing (DFM) process. There are 3 types of PCBs classified on basis of substrate materialīefore going to the actual PCB fabrication and PCB Assembly process, the manufacturer checks the PCB for any flaws or errors in the PCB that can result in malfunction. This silk screen layer provides the vital information about that PCB. The holes will attach the THT components on PCB while the PADs are used to hold SMT components.Ĥ- Silkscreen: The white labeling which we see on PCB fabrication for components designator, like R1, C1 or some sort of description on PCB or company logo it is all made of silk screen layer. The solder mask also avoids soldering on unwanted parts and assures that solder goes on that area that is meant for soldering like holes and pads. This is used to create non-conductive region of PCB and it isolates the copper traces from each other to protect short circuit. This provides the rigidity to PCB.Ģ- Copper Layer: The thin copper foil is applied on top and bottom of the PCB to create top layer and bottom layer copper traces.ģ- Solder Mask: It is the layer that is applied on top and bottom of PCB. The PCB assembly process has automated and manual process which we will discuss.ġ- Substrate: It is the rigid board made of FR-4 material onto which the components are “stuffed” or soldered. The PCB sizes are also different depends upon requirements. The functionality of PCBs can be complex or simple depending on the specifications described by the client or user. The PCB when components are assembled is called PCBA or Assembled PCB. So it is very important the components are assembled in proper way. The PCB may not work even if a tiny SMT resistor is not properly placed or even if a small track is cut from the PCB manufacturer. The most important thing is the PCB functionality. The components are assembled on the PCB to allow the PCB to function as it is designed. The electronic components on top layer are connected to inner GND plane or inner signals layer by means of “ Vias”. In most of the PCBs which are made to supply high voltage or current, there is a separate plane of ground connection. These traces can be made thick to carry power / electricity to power up components. These signals can be high speed digital signals or discrete analog signals. The copper traces are used to carry electronic signals from one point to the other on the PCB. For single sided PCB and double sided PCBs, the outer layers present but no inner layer. At RayPCB we can deliver up to 1-36 layers for multilayer PCB prototypes and 1-10 layers for multilayer PCBs for mass production. The PCB is composed of a substrate that is made of fiber glass, the components, the copper layer that makes the traces, holes in which components are fitted and layers that can be inner layer and outer layers. These components are soldered upon the PCBs in the process called “ PCB Assembly” or PCBA. The PCB is something that is usually green in color and is a rigid body that holds various electronic components on it. The core of these equipment is electronics engineering and the nucleus is the Printed Circuit Boards (PCBs). This technological advancement has brought many advance equipment in the world that we did not imagine about 10 years ago. The world is growing at a very fast pace in terms of modern technology and the effects are easily on our daily lives.
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